Application

11721067 · METHOD FOR APPLYING AN ADHESIVE LAYER ON THIN CUT SEMICONDUCTOR CHIPS OF SEMICONDUCTOR WAFERS

Filed 2009-11-16 · Abandoned The official file ↗ · Art unit 1746 · Examiner Margaret Brodie Hard · CPC H10P 72/74 · QIMONDA AG · DICKE, BILLIG & CZAJA

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

28.6 mo

to disposition 35.3 mo

Statutes raised

102 103 112

1 actions read

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