Application

12127357 · SEMICONDUCTOR DEVICE AND METHOD OF FORMING DOUBLE-SIDED THROUGH VIAS IN SAW STREETS

Filed 2008-05-27 · Granted · Patent 7666711 (2010-02-23) The official file ↗The patent and its PDF ↗ · Art unit 2895 · Examiner Morgan T Varner · CPC H10W 90/00 · STATS CHIPPAC, INC. · STATS ChipPAC/PATENT LAW GROUP:

Office actions

first was Restriction requirement

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no appeal

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to disposition 20.9 mo

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