Application

12369376 · METHOD OF FORMING SEMICONDUCTOR DEVICES CONTAINING METAL CAP LAYERS

Filed 2009-02-11 · Granted · Patent 7871929 (2011-01-18) The official file ↗The patent and its PDF ↗ · Art unit 2813 · Examiner Jessica Hall Hard · CPC H10W 20/425 · TEL MANUFACTURING AND ENGINEERING OF AMERICA, INC. · WOOD, HERRON & EVANS, LLP (TOKYO ELECTRON)

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

15.3 mo

to disposition 23.2 mo

Statutes raised

102 103 DP

1 actions read

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