Application

12759699 · METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A POST/BASE HEAT SPREADER AND DUAL ADHESIVES

Filed 2010-04-14 · Granted · Patent 8003416 (2011-08-23) The official file ↗The patent and its PDF ↗ · Art unit 2894 · Examiner David E Graybill Typical · CPC H10W 70/095 · David Sigmond

Office actions

first was Notice of allowance

RCEs

no appeal

To first action

14.3 mo

to disposition 16.3 mo

Statutes raised

0 actions read

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