Application

12853100 · METHOD OF FORMING A BOND PAD

Filed 2010-08-09 · Granted · Patent 8043961 (2011-10-25) The official file ↗The patent and its PDF ↗ · Art unit 2818 · Examiner Dung Anh Le Easy · CPC H10N 70/826 · OVONYX MEMORY TECHNOLOGY, LLC · DICKSTEIN SHAPIRO LLP

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

2.9 mo

to disposition 14.5 mo

Statutes raised

103

1 actions read

Unlock the prosecution timelineIncluded in Pro, from $29 a month. Cancel any time.