Application

13052258 · THROUGH-SILICON VIA FORMED WITH A POST PASSIVATION INTERCONNECT STRUCTURE

Filed 2011-03-21 · Granted · Patent 8390125 (2013-03-05) The official file ↗The patent and its PDF ↗ · Art unit 2894 · Examiner Marvin Payen Easy · CPC H10W 20/023 · MAGO BARCA IP LLC · Hauptman Ham, LLP (TSMC)

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

9.0 mo

to disposition 23.5 mo

Statutes raised

102 103

1 actions read

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