Application

13078928 · SEMICONDUCTOR CHIP ASSEMBLY WITH POST/BASE HEAT SPREADER AND PLATED THROUGH-HOLE

Filed 2011-04-02 · Granted · Patent 8129742 (2012-03-06) The official file ↗The patent and its PDF ↗ · Art unit 2891 · Examiner Abbigale A Boyle Hard · CPC H10W 70/095 · BRIDGE SEMICONDUCTOR CORPORATION · David Sigmond

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

7.6 mo

to disposition 11.1 mo

Statutes raised

103

1 actions read

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