Application

13137984 · METHOD OF MANUFACTURING WAFER LEVEL PACKAGE

Filed 2011-09-22 · Granted · Patent 8283251 (2012-10-09) The official file ↗The patent and its PDF ↗ · Art unit 2800 · Examiner Matthew S Smith Easy · CPC H10W 70/60 · STAAS & HALSEY LLP

Office actions

first was Notice of allowance

RCEs

no appeal

To first action

8.5 mo

to disposition 12.6 mo

Statutes raised

0 actions read

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