Application

13182137 · LEAD FRAME BASED SEMICONDUCTOR PACKAGE AND A METHOD OF MANUFACTURING THE SAME

Filed 2011-07-13 · Granted · Patent 8283762 (2012-10-09) The official file ↗The patent and its PDF ↗ · Art unit 2823 · Examiner Wilner Jean Baptiste Typical · CPC H10W 70/411 · NXP B.V. · NXP-LARSON NEWMAN, LLP

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

3.0 mo

to disposition 14.9 mo

Statutes raised

102 103

1 actions read

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