Application

13299564 · SEMICONDUCTOR DEVICE PACKAGING HAVING SUBSTRATE WITH PRE-ENCAPSULATION THROUGH VIA FORMATION

Filed 2011-11-18 · Granted · Patent 8597983 (2013-12-03) The official file ↗The patent and its PDF ↗ · Art unit 2823 · Examiner Nicholas J Tobergte Easy · CPC H10W 70/099 · NXP B.V. · NXP USA, INC.

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

12.8 mo

to disposition 24.5 mo

Statutes raised

103 DP

2 actions read

Unlock the prosecution timelineIncluded in Pro, from $29 a month. Cancel any time.