Application

13345836 · METHOD OF POST-MOLD GRINDING A SEMICONDUCTOR PACKAGE

Filed 2012-01-09 · Abandoned The official file ↗ · Art unit 2818 · Examiner Kimberly M Thomas Hard · CPC H10W 74/014 · Winkle, PLLC

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

3.7 mo

to disposition 13.6 mo

Statutes raised

102 103

1 actions read

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