Application

13351741 · REACTION APPARATUS FOR PROCESSING WAFER, ELECTROSTATIC CHUCK AND WAFER TEMPERATURE CONTROL METHOD

Filed 2012-01-17 · Granted · Patent 8952297 (2015-02-10) The official file ↗The patent and its PDF ↗ · Art unit 3742 · Examiner Shawntina T Fuqua Easy · CPC H10P 72/0436 · SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING) CORPORATION · KOPPEL, PATRICK, HEYBL & PHILPOTT

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

27.5 mo

to disposition 36.8 mo

Statutes raised

102 103

1 actions read

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