PATLY.AIApplication
13398647 · SYSTEM FOR SEPARATING A DICED SEMICONDUCTOR DIE FROM A DIE ATTACH TAPE
Filed 2012-02-16 · Granted · Patent 8499813 (2013-08-06) The official file ↗The patent and its PDF ↗ · Art unit 1745 · Examiner Nickolas R Harm Typical · CPC H10P 72/0442 · WODEN TECHNOLOGIES INC. · Pearl Cohen LLP / Sandisk
Office actions
2
first was Non-final rejection
RCEs
1
no appeal
To first action
1.1 mo
to disposition 17.6 mo
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