Application

13403458 · METHOD FOR FORMING DIE ASSEMBLY WITH HEAT SPREADER

Filed 2012-02-23 · Granted · Patent 9059144 (2015-06-16) The official file ↗The patent and its PDF ↗ · Art unit 2822 · Examiner Damian A Hillman Typical · CPC H10W 40/778 · NXP B.V. · NXP USA, INC.

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

10.2 mo

to disposition 39.7 mo

Statutes raised

103

4 actions read

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