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13499899 · METHOD OF PRODUCING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE HAVING A THROUGH-WAFER INTERCONNECT

Filed 2012-07-27 · Granted · Patent 8633107 (2014-01-21) The official file ↗The patent and its PDF ↗ · Art unit 2894 · Examiner Timor Karimy Typical · CPC H10W 20/023 · AUSTRIAMICROSYSTEMS AG · McDermott Will & Schulte LLP

Office actions
1
first was Restriction requirement
RCEs
0
no appeal
To first action
8.1 mo
to disposition 17.8 mo
Statutes raised
102 103
1 actions read
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