Application

13572376 · THIN FILM STRUCTURE FOR HIGH DENSITY INDUCTORS AND REDISTRIBUTION IN WAFER LEVEL PACKAGING

Filed 2012-08-10 · Granted · Patent 9018750 (2015-04-28) The official file ↗The patent and its PDF ↗ · Art unit 2816 · Examiner Jasmine Jhihan B Clark Easy · CPC H10W 70/614 · HUATIAN TECHNOLOGY(KUNSHAN) ELECTRONICS CO.,LTD. · Flip Chip International, LLC

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

14.8 mo

to disposition 32.6 mo

Statutes raised

102 103

2 actions read

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