Application

13573968 · Electronic module with heat spreading enclosure

Filed 2012-10-17 · Granted · Patent 8837141 (2014-09-16) The official file ↗The patent and its PDF ↗ · Art unit 2835 · Examiner Michail V Datskovskiy Easy · CPC H05K 1/147 · MICROELECTRONICS ASSEMBLY TECHNOLOGIES, INC · ROBERT J. LAUF

Office actions

first was Notice of allowance

RCEs

no appeal

To first action

21.1 mo

to disposition 23.0 mo

Statutes raised

0 actions read

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