Application

13644579 · WAFER LEVEL APPLIED THERMAL HEAT SINK

Filed 2012-10-04 · Granted · Patent 8686556 (2014-04-01) The official file ↗The patent and its PDF ↗ · Art unit 2818 · Examiner Dung Anh Le Easy · CPC H10W 70/68 · FLIPCHIP INTERNATIONAL, LLC · Flip Chip International LLC

Office actions

first was Restriction requirement

RCEs

no appeal

To first action

12.0 mo

to disposition 17.9 mo

Statutes raised

0 actions read

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