PATLY.AIApplication
13739130 · SEMICONDUCTOR DEVICE COMPRISING METALLIZATION LAYERS OF REDUCED INTERLAYER CAPACITANCE BY REDUCING THE AMOUNT OF ETCH STOP MATERIALS
Filed 2013-01-11 · Granted · Patent 8922023 (2014-12-30) The official file ↗The patent and its PDF ↗ · Art unit 2814 · Examiner Theresa T Doan Easy · CPC H10W 20/084 · GLOBALFOUNDRIES U.S. INC. · GLOBALFOUNDRIES INC.
Office actions
1
first was Non-final rejection
RCEs
0
no appeal
To first action
18.3 mo
to disposition 23.6 mo
Statutes raised
102 103
1 actions read