Application

13829739 · SEMICONDUCTOR DEVICE WITH DIE STACK ARRANGEMENT INCLUDING STAGGERED DIE AND EFFICIENT WIRE BONDING

Filed 2013-03-14 · Granted · Patent 8853863 (2014-10-07) The official file ↗The patent and its PDF ↗ · Art unit 2893 · Examiner Hoa B Trinh Typical · CPC H10W 70/685 · SANDISK TECHNOLOGIES INC. · Pearl Cohen LLP / Sandisk

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

9.1 mo

to disposition 18.8 mo

Statutes raised

102 103

1 actions read

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