Application

13939743 · EPOXY RESIN COMPOSITION FOR BUILD-UP INSULATING FILM, INSULATING FILM FORMED THEREFROM, AND MULTILAYER PRINTED CIRCUIT BOARD HAVING THE SAME

Filed 2013-07-11 · Abandoned The official file ↗ · Art unit 1764 · Examiner Kregg T Brooks Typical · CPC C08L 63/00 · SAMSUNG ELECTRO-MECHANICS CO., LTD. · Los Angeles-LADAS & PARRY

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

9.9 mo

to disposition 16.3 mo

Statutes raised

102 103 112

1 actions read

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