Application

14019351 · SEMICONDUCTOR DIE PACKAGE AND METHOD FOR MAKING THE SAME

Filed 2013-09-05 · Granted · Patent 9159656 (2015-10-13) The official file ↗The patent and its PDF ↗ · Art unit 2898 · Examiner Yasser A Abdelaziez Easy · CPC H10W 90/811 · Fairchild Semiconductor Corporation · onsemi (BHB)

Office actions

first was Restriction requirement

RCEs

no appeal

To first action

12.8 mo

to disposition 25.2 mo

Statutes raised

102 103

1 actions read

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