Application

14036999 · PACKAGE ASSEMBLY FOR THIN WAFER SHIPPING AND METHOD OF USE

Filed 2013-09-25 · Granted · Patent 9543175 (2017-01-10) The official file ↗The patent and its PDF ↗ · Art unit 3788 · Examiner Steven Alan Reynolds Typical · CPC H10P 72/1912 · INTERNATIONAL BUSINESS MACHINES CORPORATION · INACTIVE - POU IPLAW

Office actions

first was Restriction requirement

RCEs

no appeal

To first action

24.8 mo

to disposition 39.5 mo

Statutes raised

103

2 actions read

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