PATLY.AIApplication
14138466 · EPOXY RESIN COMPOSITION FOR ENCAPSULATION OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE ENCAPSULATED USING THE SAME
Filed 2013-12-23 · Abandoned The official file ↗ · Art unit 1764 · Examiner Kregg T Brooks Typical · CPC C08L 63/00 · CHEIL INDUSTRIES, INC. · LEE IP LAW, P.C.
Office actions
2
first was Non-final rejection
RCEs
0
no appeal
To first action
15.9 mo
to disposition 26.5 mo
Statutes raised
102 103 112
2 actions read