Application

14176388 · CIRCUIT ASSEMBLIES INCLUDING THERMOELECTRIC MODULES

Filed 2014-02-10 · Granted · Patent 9322580 (2016-04-26) The official file ↗The patent and its PDF ↗ · Art unit 2835 · Examiner Courtney L Smith Typical · CPC H10W 40/28 · Laird Technologies, Inc. · Harness Dickey (St. Louis)

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

19.1 mo

to disposition 26.5 mo

Statutes raised

1 actions read

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