Application

14186362 · METHOD OF FABRICATING A 3D INTEGRATED ELECTRONIC DEVICE STRUCTURE INCLUDING INCREASED THERMAL DISSIPATION CAPABILITIES

Filed 2014-02-21 · Granted · Patent 8802475 (2014-08-12) The official file ↗The patent and its PDF ↗ · Art unit 2815 · Examiner Chris C Chu Easy · CPC B81B 3/0081 · RUSHMORE TECHNOLOGIES, LLC · Ascenda Law Group, PC

Office actions

first was Notice of allowance

RCEs

no appeal

To first action

1.7 mo

to disposition 5.7 mo

Statutes raised

0 actions read

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