Application

14202756 · INTEGRATED BONDLINE SPACERS FOR WAFER LEVEL PACKAGED CIRCUIT DEVICES

Filed 2014-03-10 · Granted · Patent 9187312 (2015-11-17) The official file ↗The patent and its PDF ↗ · Art unit 2892 · Examiner Quoc Dinh Hoang Easy · CPC B81B 7/0041 · RAYTHEON COMPANY · Cantor Colburn LLP - Raytheon

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

11.9 mo

to disposition 20.3 mo

Statutes raised

102

1 actions read

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