Application

14254434 · METHOD AND APPARATUS PROVIDING INTEGRATED CIRCUIT HAVING REDISTRIBUTION LAYER WITH RECESSED CONNECTORS

Filed 2014-04-16 · Granted · Patent 9355934 (2016-05-31) The official file ↗The patent and its PDF ↗ · Art unit 2894 · Examiner Errol V Fernandes Easy · CPC H10W 20/20 · MICRON TECHNOLOGY, INC. · PERKINS COIE LLP - Micron

Office actions

first was Non-final rejection

RCEs

appealed

To first action

3.1 mo

to disposition 25.5 mo

Statutes raised

102 103 112

3 actions read

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