Application
14265609 · SEMICONDUCTOR CONSTRUCTIONS, SEMICONDUCTOR PROCESSING METHODS, METHODS OF FORMING CONTACT PADS, AND METHODS OF FORMING ELECTRICAL CONNECTIONS BETWEEN METAL-CONTAINING LAYERS
Filed 2014-04-30 · Granted · Patent 8963331 (2015-02-24) The official file ↗The patent and its PDF ↗ · Art unit 2815 · Examiner Chris C Chu Easy · CPC H10W 20/425 · Micron Technology, Inc. · Wells St. John P.S.
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