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14288726 · METHOD FOR MANUFACTURING A SEMICONDUCTOR CHIP WITH EACH CONTACT PAD HAVING A PAD CELL ASSOCIATED THEREWITH

Filed 2014-05-28 · Granted · Patent 9299673 (2016-03-29) The official file ↗The patent and its PDF ↗ · Art unit 2826 · Examiner Alexander O Williams Typical · CPC G11C 5/06 · Infineon Technologies AG · Eschweiler & Potashnik, LLC (Infineon)

Office actions
1
first was Restriction requirement
RCEs
0
no appeal
To first action
10.2 mo
to disposition 22.0 mo
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