Application

14323960 · PACKAGE FOR THREE DIMENSIONAL INTEGRATED CIRCUIT

Filed 2014-07-03 · Granted · Patent 9337063 (2016-05-10) The official file ↗The patent and its PDF ↗ · Art unit 2826 · Examiner Herve-Louis Y Assouman Typical · CPC H10W 74/012 · Taiwan Semiconductor Manufacturing Company, Ltd. · Intellectual Property Division

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

13.7 mo

to disposition 22.2 mo

Statutes raised

103

1 actions read

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