Application

14338754 · METHOD OF ETCHING A WAFER

Filed 2014-07-23 · Granted · Patent 9150408 (2015-10-06) The official file ↗The patent and its PDF ↗ · Art unit 2814 · Examiner Howard Weiss Hard · CPC B81C 1/00269 · Analog Devices, Inc. · Analog Devices Inc.

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

7.1 mo

to disposition 14.5 mo

Statutes raised

102 103 DP

1 actions read

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