Application

14448186 · METHODS FOR REMOVING ADHESIVE LAYERS FROM SEMICONDUCTOR WAFERS

Filed 2014-07-31 · Granted · Patent 9111983 (2015-08-18) The official file ↗The patent and its PDF ↗ · Art unit 2891 · Examiner Davis Thai Easy · CPC H10P 72/74 · NXP B.V. · NXP USA, INC.

Office actions

first was Notice of allowance

RCEs

no appeal

To first action

10.9 mo

to disposition 12.6 mo

Statutes raised

0 actions read

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