Application

14456156 · INTEGRATED BONDLINE SPACERS FOR WAFER LEVEL PACKAGED CIRCUIT DEVICES

Filed 2014-08-11 · Granted · Patent 9174836 (2015-11-03) The official file ↗The patent and its PDF ↗ · Art unit 2892 · Examiner Quoc Dinh Hoang Easy · CPC B81B 7/0041 · Raytheon Company · Cantor Colburn LLP - Raytheon

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

6.4 mo

to disposition 14.8 mo

Statutes raised

102 DP

1 actions read

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