Application

14479829 · COMPLIANT MULTILAYERED THERMALLY-CONDUCTIVE INTERFACE ASSEMBLIES

Filed 2014-09-08 · Granted · Patent 9222735 (2015-12-29) The official file ↗The patent and its PDF ↗ · Art unit 2835 · Examiner Courtney L Smith Typical · CPC F28F 13/003 · Laird Technologies, Inc. · Harness Dickey (St. Louis)

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

7.7 mo

to disposition 15.7 mo

Statutes raised

1 actions read

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