Application
14496049 · ENHANCED BOARD LEVEL RELIABILITY FOR WAFER LEVEL PACKAGES
Filed 2014-09-25 · Granted · Patent 9837368 (2017-12-05) The official file ↗The patent and its PDF ↗ · Art unit 2814 · Examiner Suian Tang Hard · CPC H10W 74/121 · Maxim Integrated Products, Inc. · Advent/Maxim
Office actions
4
first was Restriction requirement
RCEs
1
appealed
To first action
6.2 mo
to disposition 38.3 mo
Statutes raised
103 112
4 actions read