Application

14525069 · NO FLOW UNDERFILL OR WAFER LEVEL UNDERFILL AND SOLDER COLUMNS

Filed 2014-10-27 · Granted · Patent 9305896 (2016-04-05) The official file ↗The patent and its PDF ↗ · Art unit 2891 · Examiner Davis Thai Easy · CPC H10P 52/00 · International Business Machines Corporation · INTERNATIONAL BUSINESS MACHINES CORPORATION

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

9.8 mo

to disposition 17.3 mo

Statutes raised

1 actions read

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