Application

14526268 · NO FLOW UNDERFILL OR WAFER LEVEL UNDERFILL AND SOLDER COLUMNS

Filed 2014-10-28 · Granted · Patent 9343423 (2016-05-17) The official file ↗The patent and its PDF ↗ · Art unit 2891 · Examiner Davis Thai Easy · CPC H10P 52/00 · INTERNATIONAL BUSINESS MACHINES CORPORATION · INTERNATIONAL BUSINESS MACHINES CORPORATION

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

9.4 mo

to disposition 18.6 mo

Statutes raised

112

1 actions read

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