Application

14600320 · System, Method and Apparatus to Relieve Stresses in a Semiconductor Wafer Caused by Uneven Internal Metallization Layers

Filed 2015-01-20 · Granted · Patent 9564404 (2017-02-07) The official file ↗The patent and its PDF ↗ · Art unit 2898 · Examiner Moin M Rahman Typical · CPC H10W 42/121 · SanDisk Technologies Inc. · WESTERN DIGITAL CORPORATION_SDC18

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

13.5 mo

to disposition 24.6 mo

Statutes raised

103

1 actions read

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