Application

14613081 · WAFER PROCESSING SYSTEM WITH CHUCK ASSEMBLY MAINTENANCE MODULE

Filed 2015-02-03 · Granted · Patent 9812344 (2017-11-07) The official file ↗The patent and its PDF ↗ · Art unit 1711 · Examiner Jason Paul Riggleman Typical · CPC H10P 72/3308 · APPLIED Materials, Inc. · APPLIED MATERIALS, INC.

Office actions

first was Restriction requirement

RCEs

no appeal

To first action

18.2 mo

to disposition 33.1 mo

Statutes raised

103 112

2 actions read

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