Application

14624469 · SYSTEM FOR OVER-MOLDED PCB SEALING RING FOR TEC HEAT EXCHANGERS

Filed 2015-02-17 · Granted · Patent 10161642 (2018-12-25) The official file ↗The patent and its PDF ↗ · Art unit 3763 · Examiner Tzvi Samuel Tanenbaum Typical · CPC F24F 5/0042 · Marlow Industries, Inc. · Blank Rome LLP - II-VI

Office actions

first was Restriction requirement

RCEs

no appeal

To first action

29.5 mo

to disposition 46.2 mo

Statutes raised

102 103 112

1 actions read

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