Application

14644473 · METHODS FOR FORMING PILLAR BUMPS ON SEMICONDUCTOR WAFERS

Filed 2015-03-11 · Granted · Patent 9831201 (2017-11-28) The official file ↗The patent and its PDF ↗ · Art unit 2894 · Examiner Errol V Fernandes Easy · CPC H10W 72/012 · FLIPCHIP INTERNATIONAL LLC · Arno T. Naeckel

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

18.3 mo

to disposition 32.6 mo

Statutes raised

103

1 actions read

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