Application

14659905 · INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SURFACE TREATMENT AND METHOD OF MANUFACTURE THEREOF

Filed 2015-03-17 · Granted · Patent 9385100 (2016-07-05) The official file ↗The patent and its PDF ↗ · Art unit 2816 · Examiner Jasmine Jhihan B Clark Easy · CPC H10W 70/635 · STATS CHIPPAC MANAGEMENT PTE. LTD. · ISHIMARU & ASSOCIATES LLP

Office actions

first was Restriction requirement

RCEs

no appeal

To first action

4.2 mo

to disposition 15.6 mo

Statutes raised

103

1 actions read

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