Application

14706663 · EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE ENCAPSULATED USING THE SAME

Filed 2015-05-07 · Granted · Patent 9673120 (2017-06-06) The official file ↗The patent and its PDF ↗ · Art unit 2897 · Examiner Alonzo Chambliss Typical · CPC H10W 74/476 · SAMSUNG SDI CO., LTD. · LEE IP LAW, P.C.

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

10.2 mo

to disposition 25.0 mo

Statutes raised

103 112

2 actions read

Unlock the prosecution timelineIncluded in Pro, from $29 a month. Cancel any time.