Application

14722810 · METHOD AND APPARATUS FOR ASSEMBLING A SEMICONDUCTOR PACKAGE

Filed 2015-05-27 · Granted · Patent 9461009 (2016-10-04) The official file ↗The patent and its PDF ↗ · Art unit 2897 · Examiner Vu A Vu Easy · CPC H10W 74/019 · FREESCALE SEMICONDUCTOR, INC. · NXP USA, INC.

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

8.5 mo

to disposition 16.3 mo

Statutes raised

103

1 actions read

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