Application

14734192 · WAFER LEVEL PACKAGE AND FABRICATION METHOD

Filed 2015-06-09 · Granted · Patent 9406645 (2016-08-02) The official file ↗The patent and its PDF ↗ · Art unit 2892 · Examiner Lalrinfamkim Hmar Malsawma Easy · CPC H10W 72/0198 · Amkor Technology, Inc. · Amkor Technology Singapore Holding Pte. Ltd.

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

3.7 mo

to disposition 13.8 mo

Statutes raised

102 103

1 actions read

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