Application

14791287 · INTEGRATED CIRCUIT SYSTEM WITH DEBONDING ADHESIVE AND METHOD OF MANUFACTURE THEREOF

Filed 2015-07-03 · Granted · Patent 9355993 (2016-05-31) The official file ↗The patent and its PDF ↗ · Art unit 2818 · Examiner Niki Hoang Nguyen Easy · CPC H10P 54/00 · JCET SEMICONDUCTOR (SHAOXING) CO., LTD. · ISHIMARU & ASSOCIATES LLP

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

2.6 mo

to disposition 10.9 mo

Statutes raised

102 103

1 actions read

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