Application

14803612 · MULTI-DIE, HIGH CURRENT WAFER LEVEL PACKAGE

Filed 2015-07-20 · Granted · Patent 9230903 (2016-01-05) The official file ↗The patent and its PDF ↗ · Art unit 2823 · Examiner Walter H Swanson Typical · CPC H10W 70/65 · Maxim Integrated Products, Inc. · Advent/Maxim

Office actions

first was Notice of allowance

RCEs

no appeal

To first action

1.3 mo

to disposition 5.6 mo

Statutes raised

0 actions read

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