Application

14814271 · EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE ENCAPSULATED USING THE SAME

Filed 2015-07-30 · Abandoned The official file ↗ · Art unit 1764 · Examiner Kregg T Brooks Typical · CPC H10W 74/473 · SAMSUNG SDI CO., LTD. · LEE IP LAW, P.C.

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

17.4 mo

to disposition 34.7 mo

Statutes raised

102 103 112 DP

3 actions read

Unlock the prosecution timelineIncluded in Pro, from $29 a month. Cancel any time.