PATLY.AIApplication
14825778 · TSV WAFER WITH IMPROVED FRACTURE STRENGTH
Filed 2015-08-13 · Granted · Patent 9607929 (2017-03-28) The official file ↗The patent and its PDF ↗ · Art unit 2817 · Examiner Mikka H Liu Typical · CPC H10W 20/20 · International Business Machines Corporation · INACTIVE - POU IPLAW
Office actions
2
first was Non-final rejection
RCEs
0
no appeal
To first action
3.6 mo
to disposition 19.5 mo
Statutes raised
102 103 112
2 actions read